Sandisk Technologies, Inc. Principal Engineer, Packaging Engineering H-1B Salary
Sandisk Technologies, Inc. pays a median H-1B base salary of $173,378 for Principal Engineer, Packaging Engineering, across 8 certified LCAs.
Median wage
$173,378
Average wage
$175,718
Range
$170,248–$185,869
25th–90th pct
Certified LCAs
8
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $170,248
- 25th
- $170,248
- Median
- $173,378
- Average
- $175,718
- 90th
- $185,869
- Highest
- $185,869
Based on 8 certified base wages, annualized.
Filings by year
4FY25
4FY26
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Milpitas, CA | 5 | $176,509 |
| San Jose, CA | 2 | $173,378 |
| Fremont, CA | 1 | $170,248 |