Rohde & Schwarz USA, Inc. Wireless Chipset Application Engineer H-1B Salary
Rohde & Schwarz USA, Inc. pays a median H-1B base salary of $198,000 for Wireless Chipset Application Engineer, across 5 certified LCAs.
Median wage
$198,000
Average wage
$176,800
Range
$143,000–$200,000
25th–90th pct
Certified LCAs
5
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $143,000
- 25th
- $143,000
- Median
- $198,000
- Average
- $176,800
- 90th
- $200,000
- Highest
- $200,000
Based on 5 certified base wages, annualized.
Filings by year
1FY20
2FY21
2FY23
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Milpitas, CA | 3 | $200,000 |
| San Diego, CA | 2 | $143,000 |