Qualcomm Technologies, Inc. Senior Packaging Engineer H-1B Salary
Qualcomm Technologies, Inc. pays a median H-1B base salary of $115,500 for Senior Packaging Engineer, across 18 certified LCAs.
Median wage
$115,500
Average wage
$121,843
Range
$115,500–$128,898
25th–90th pct
Certified LCAs
18
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $112,800
- 25th
- $115,500
- Median
- $115,500
- Average
- $121,843
- 90th
- $128,898
- Highest
- $156,853
Based on 18 certified base wages, annualized.
Filings by year
3FY22
3FY23
4FY24
4FY25
4FY26
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| San Diego, CA | 13 | $115,500 |
| Austin, TX | 2 | $121,350 |
| Irvine, CA | 1 | $112,800 |
| Arcadia, CA | 1 | $115,500 |
| Santa Clara, CA | 1 | $156,853 |