Qualcomm Technologies, Inc. Packaging Engineer H-1B Salary
Qualcomm Technologies, Inc. pays a median H-1B base salary of $112,882 for Packaging Engineer, across 20 certified LCAs.
Median wage
$112,882
Average wage
$119,101
Range
$108,638–$144,000
25th–90th pct
Certified LCAs
20
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $98,500
- 25th
- $108,638
- Median
- $112,882
- Average
- $119,101
- 90th
- $144,000
- Highest
- $156,853
Based on 20 certified base wages, annualized.
Filings by year
7FY23
5FY24
5FY25
3FY26
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| San Diego, CA | 11 | $119,434 |
| Austin, TX | 5 | $108,638 |
| Santa Clara, CA | 3 | $140,805 |
| Bryan, TX | 1 | $98,500 |