NXP USA, INC. Semiconductor Packaging Engineer H-1B Salary
NXP USA, INC. pays a median H-1B base salary of $130,000 for Semiconductor Packaging Engineer, across 9 certified LCAs.
Median wage
$130,000
Average wage
$126,689
Range
$110,000–$151,916
25th–90th pct
Certified LCAs
9
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $76,800
- 25th
- $110,000
- Median
- $130,000
- Average
- $126,689
- 90th
- $151,916
- Highest
- $155,530
Based on 9 certified base wages, annualized.
Filings by year
2FY22
4FY23
3FY25
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Austin, TX | 8 | $132,500 |
| Chandler, AZ | 1 | $130,000 |