Micron Technology, Inc. R&D Dry Etch Process Development Engineer H-1B Salary
Micron Technology, Inc. pays a median H-1B base salary of $102,259 for R&D Dry Etch Process Development Engineer, across 11 certified LCAs.
Median wage
$102,259
Average wage
$106,002
Range
$100,000–$118,999
25th–90th pct
Certified LCAs
11
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $95,000
- 25th
- $100,000
- Median
- $102,259
- Average
- $106,002
- 90th
- $118,999
- Highest
- $126,499
Based on 11 certified base wages, annualized.
Filings by year
1FY20
7FY21
1FY22
1FY23
1FY24
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Boise, ID | 11 | $102,259 |