Micron Technology, Inc. Dry Etch Process Development Engineer H-1B Salary
Micron Technology, Inc. pays a median H-1B base salary of $119,017 for Dry Etch Process Development Engineer, across 7 certified LCAs.
Median wage
$119,017
Average wage
$123,084
Range
$118,469–$141,846
25th–90th pct
Certified LCAs
7
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $98,940
- 25th
- $118,469
- Median
- $119,017
- Average
- $123,084
- 90th
- $141,846
- Highest
- $141,846
Based on 7 certified base wages, annualized.
Filings by year
2FY21
3FY22
1FY23
1FY25
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Boise, ID | 7 | $119,017 |