Intel Corporation Packaging R&D Engineer H-1B Salary
Intel Corporation pays a median H-1B base salary of $161,117 for Packaging R&D Engineer, across 9 certified LCAs.
Median wage
$161,117
Average wage
$148,180
Range
$117,146–$183,452
25th–90th pct
Certified LCAs
9
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $98,030
- 25th
- $117,146
- Median
- $161,117
- Average
- $148,180
- 90th
- $183,452
- Highest
- $192,005
Based on 9 certified base wages, annualized.
Filings by year
4FY22
1FY23
1FY24
3FY25
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Chandler, AZ | 7 | $117,146 |
| Austin, TX | 1 | $192,005 |
| Round Rock, TX | 1 | $181,314 |