Allegro MicroSystems, LLC Microelectronics Packaging Engineer H-1B Salary
Allegro MicroSystems, LLC pays a median H-1B base salary of $95,000 for Microelectronics Packaging Engineer, across 7 certified LCAs.
Median wage
$95,000
Average wage
$98,529
Range
$95,000–$106,771
25th–90th pct
Certified LCAs
7
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $87,975
- 25th
- $95,000
- Median
- $95,000
- Average
- $98,529
- 90th
- $106,771
- Highest
- $116,325
Based on 7 certified base wages, annualized.
Filings by year
2FY21
2FY22
2FY24
1FY25
Top locations for this role
| Location | LCAs | Median |
|---|---|---|
| Manchester, NH | 7 | $95,000 |