H-1B Principal Engineer - Firmware Salary
The median H-1B base salary for a Principal Engineer - Firmware is $134,493, across 22 certified LCAs.
Median wage
$134,493
Average wage
$146,808
90th percentile
$203,668
Certified LCAs
22
Salary distribution
Annualized base salary on certified LCAs. Excludes bonus and stock.
25th
Median
75th
90th
- Lowest
- $105,269
- 25th
- $121,748
- Median
- $134,493
- Average
- $146,808
- 90th
- $203,668
- Highest
- $264,514
Based on 22 certified base wages, annualized.
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Filings by year
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Top H-1B sponsors for Principal Engineer - Firmware
Employers ranked by certified LCA volume for this role.
| Company↕ | LCAs↕ | Median▼ |
|---|---|---|
| Samsung Semiconductor, Inc. | 2 | $236,257 |
| Infineon Technologies Americas Corp. | 1 | $233,394 |
| CYPRESS SEMICONDUCTOR CORPORATION | 1 | $164,676 |
| Microchip Technology Inc. | 14 | $132,694 |
| CalAmp Wireless Networks Corporation | 4 | $127,993 |